ゼストロンジャパン Company Profile

Modern electronic devices are highly advanced, and even minor malfunctions can lead to significant incidents. Events that undermine insulation threaten the reliability of products, and one phenomenon that can contribute to this is ion migration, which has been considered a past issue. It has been said that this has been overcome due to the evolution of various insulating materials such as coatings and resists, as well as advancements in cleaning-free technologies. However, as the miniaturization and high density of electronic substrates rapidly progress, ensuring insulation has become increasingly difficult, and the risk of ion migration is once again on the rise. This article will explain why ion migration has become a trend again, exploring its mechanisms, specific countermeasures, and evaluation methods to assess the potential for its occurrence. You can view the detailed content of the article through the related links.

"Before the resin encapsulation of semiconductors." We have added a page to the technical document titled "Why Did the 'Silent Evolution' Occur?" The article provides a detailed explanation of the basic concepts of semiconductor resin encapsulation, as well as specific approaches to surface treatment that are key to maximizing quality. Additionally, the technical document systematically organizes the mechanisms behind the deterioration of insulation and the instability of resin bonding strength, and explains advanced insights into surface design and cleaning technologies that are essential for high-reliability devices. We encourage you to read it.

Flux residues require the selection of analytical methods based on their type. By conducting chemical analysis, it is possible to analyze the causes of defects and improve processes. You can download a free document summarizing our analysis service overview. If you are struggling with cleaning processes or defect analysis, please take a look. Zestron offers cleanliness analysis technology that can comply with ISO 9455-18:2024.