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  3. Micro Module Technology Co., Ltd.
Manufacturing and processing contract
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Micro Module Technology Co., Ltd.

EstablishmentMay 30, 2008
capital1200Ten thousand
number of employees12
addressKanagawa/Tsurumi-ku, Yokohama-shi/1-1-40 Suehirocho, Inside Yokohama City Industry-Academia Collaborative Research Center
phone045-510-3080
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last updated:Dec 25, 2025
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  • Company information
  • Products/Services(9)
  • catalog(10)
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Micro Module Technology Co., Ltd. Company Profile

Declaration of a module revolution with the latest implementation technology!

We provide one-stop support for the miniaturization and thinning of electronic devices through bare chip direct mounting technology. Micro Module Technology Co., Ltd. specializes in micro-joining technologies for bare chip direct mounting and interconnection between substrates. We pursue manufacturing solutions that enable miniaturization, higher functionality, and improved cost competitiveness of electronic devices. For the downsizing and modularization of printed circuit boards, we offer integrated support covering concept planning, design and development, prototyping, evaluation and analysis, and mass production. By operating our own in-house manufacturing facilities, we realize a one-stop service and provide bare chip direct mounting technologies at more reasonable costs, which were previously difficult to adopt for small-lot production due to cost constraints. Our factory is equipped with cleanroom environments of Class 100 to 1000, enabling the production of high-quality modules and printed circuit boards. If you are considering miniaturization, thinning, or modularization of electronic circuit boards, please feel free to contact us.

Business Activities

◆ Development of miniaturized and high-performance printed circuit boards  using bare chip mounting technology, as well as various module developments ◆ Contract development of bare chip mounting processes  (Integrated support from mounting study and prototyping to evaluation and analysis) ◆ Support for various flip-chip mounting processes  (SBB, ESC, GGI, ACF & P, NCF & P, GBS) ◆ Prototyping, evaluation, and analysis of wire bonding  and stud bump processing ◆ Development, manufacturing, and sales of camera modules  and sensor packages ◆ Development and prototyping support for next-generation power modules

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Products/Services (9)

Micro Module Technology Corporation - Business Overview product image
Micro Module Technology Corporation - Business Overview
Cutting-edge technology that realizes miniaturization and high performance of semiconductors! product image
Cutting-edge technology that realizes miniaturization and high performance of semiconductors!
Ultra-compact CMOS camera module "IKURA Series" product image
Ultra-compact CMOS camera module "IKURA Series"
Contracted Service "Development and Prototyping Service" product image
Contracted Service "Development and Prototyping Service"

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catalog(10)

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MMT's module compatibility.

MMT's module compatibility.

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MMT manufacturing

MMT manufacturing

TECHNICAL
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Flip chip mounting

Flip chip mounting

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Ultra-compact camera module "IKURA-M12" series

Ultra-compact camera module "IKURA-M12" series

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news(11)

スクリーンショット 2025-12-24 164431.png

Exhibiting at Nepcon Japan 2026 [January 21, 2026 (Wed) - January 23, 2026 (Fri)]

  • NEW
  • SEMINAR_EVENT

Our company, Micro Module Technology Co., Ltd., will be exhibiting at NEPCON JAPAN 2026, one of Asia's largest electronics technology exhibitions, held at Tokyo Big Sight (Koto Ward, Tokyo) from January 21 (Wednesday) to January 23 (Friday). Our booth number is E32-62. NEPCON JAPAN is one of Japan's largest specialized exhibitions that brings together design, implementation, inspection, and manufacturing technologies in the electronics field. It attracts numerous industry professionals each year, serving as a venue for direct information exchange and business discussions about the latest technologies and solutions. At our booth, we will introduce our unique technologies and initiatives, along with examples and materials. We will also be available to discuss inquiries related to product miniaturization, high density, and quality improvement. We warmly invite you to visit our booth when you attend the event. We look forward to the opportunity to speak with you directly.

Dec 24, 2025

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Notice of Participation in "Nepcon Japan 2023" from January 25 (Wednesday) to January 27 (Friday), 2023.

  • SEMINAR_EVENT

Micro Module Technology will be exhibiting at "NEPCON Japan 2023," held at Tokyo Big Sight. This exhibition is a large-scale event with 1,100 companies participating, allowing you to compare and evaluate new electronic components, materials, manufacturing, and inspection equipment from around the world all at once. If you have concerns such as wanting to compare while watching live demonstrations or wanting to introduce new equipment to improve productivity, all of these issues can be resolved at this exhibition. We invite everyone to come and visit us. If you need an invitation, please feel free to let us know.

Jan 12, 2023

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Notice of participation in Nepcon Japan Tokyo from January 19 (Wednesday) to January 21 (Friday), 2022.

  • SEMINAR_EVENT

Our company will be exhibiting at the "Nepcon Japan Electronics Development and Implementation Exhibition" held at Tokyo Big Sight from January 19 (Wednesday) to January 21 (Friday), 2022. This exhibition will showcase world-leading electronic components, materials, mount machines, and inspection equipment that support the multifunctionality and high performance of electronics. We warmly invite electronics, semiconductor and sensor, electronic component, and automotive and electrical equipment manufacturers to visit us. We sincerely look forward to your attendance.

Jan 11, 2022

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Detailed information

Company name Micro Module Technology Co., Ltd.
number of employees12
Contact addresspostalcode 230-0045 Kanagawa/ Tsurumi-ku, Yokohama-shi/ 1-1-40 Suehirocho, Inside Yokohama City Industry-Academia Collaborative Research CenterView on map TEL:045-510-3080 FAX:045-510-3081
Business LocationsClick here for the list
Industry Manufacturing and processing contract
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